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Date: Wednesday, June 1, 2022
Time: 11:00 am - 11:45 am EDT (3:00 pm - 3:45 pm GMT)
Presenter: Bill Wetta, DSC Dredge
The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. Learn more about the use of lock-in thermography for failure analysis in electrical engineering and electronics in our online event.
By utilizing a helicopter equipped with a thermal camera, gimbal-supported aerial thermography gets a third dimension through infrared. From an elevated position an infrared camera can visualise a large thermographic overview for a variety of applications. Depending on the actual mission plan fixed-wing aircraft can provide further options for those applications as well, of course.
The generation of electricity by wind turbines is expanding worldwide. This development is associated with an increasing demand to test the reliability, functionality and life durability of wind turbines and all related subsystems, like the blades. You would like to learn more about the use of thermal imaging for the optimisation, development and maintenance of wind turbines? Then you need to regi…
You would like to know more about the advantages of thermography for thermo-elastic stress analysis? Then join the free InfraTec online event "Contactless and Non-Destructive Stress Analysis with Thermography".